Isolation regions

ABSTRACT

Methods and apparatus are provided. An isolation region is formed by lining a trench formed in a substrate with a first dielectric layer by forming the first dielectric layer adjoining exposed substrate surfaces within the trench using a high-density plasma process, forming a layer of spin-on dielectric material on the first dielectric layer so as to fill a remaining portion of the trench, and densifying the layer of spin-on dielectric material.

RELATED APPLICATION

This is a divisional application of application Ser. No. 11/486,691,titled “ISOLATION REGIONS,” filed Jul. 14, 2006 (allowed), whichapplication is assigned to the assignee of the present invention and theentire contents of which are incorporated herein by reference.

FIELD

The present invention relates generally to isolation in integratedcircuit devices and in particular the present invention relates toisolation regions.

BACKGROUND

Integrated circuit devices are typically formed on semiconductorsubstrates using semiconductor fabrication methods. Isolation trenchesare often formed in a substrate and filled with a dielectric, e.g.,shallow trench isolation (STI), to provide electrical isolation betweencomponents of an integrated circuit device. The isolation trenches areoften filled using a chemical vapor deposition process, e.g., withhigh-density plasma (HDP) oxides. However, in the quest for smallerintegrated circuit devices, spacing requirements between componentsoften require the isolation trenches to have relatively narrow widths,resulting in large aspect (or trench-depth-to-trench-width) ratios. Thelarge aspect ratios often cause voids to form within the dielectricwhile filling these trenches.

Memory device fabrication is an example where problems exist withfilling large-aspect-ratio isolation trenches. In general, memorydevices contain an array of memory cells for storing data, and row andcolumn decoder circuits coupled to the array of memory cells foraccessing the array of memory cells in response to an external address.During fabrication, the isolation trenches are formed between successivecolumns of memory cells of the array and are filled with dielectrics toelectrically isolate the columns from each other. As memory devicescontinue to become smaller in size, the spacing between the columns isreduced and thus exacerbates the problems of void formation.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art foralternative trench filling processes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustration of an integrated circuit device,according to an embodiment of the invention.

FIG. 2 is a schematic of a NAND memory array in accordance with anotherembodiment of the invention.

FIG. 3 is a schematic of a NOR memory array in accordance with anotherembodiment of the invention.

FIG. 4 is an illustration of an exemplary memory module, according toanother embodiment of the invention.

FIGS. 5A-5J are cross-sectional views of a portion of a row of a memoryarray during various stages of fabrication, according to anotherembodiment of the invention.

DETAILED DESCRIPTION

In the following detailed description of the invention, reference ismade to the accompanying drawings that form a part hereof, and in whichis shown, by way of illustration, specific embodiments in which theinvention may be practiced. In the drawings, like numerals describesubstantially similar components throughout the several views. Theseembodiments are described in sufficient detail to enable those skilledin the art to practice the invention. Other embodiments may be utilizedand structural, logical, and electrical changes may be made withoutdeparting from the scope of the present invention. The term wafer orsubstrate used in the following description includes any basesemiconductor structure. Both are to be understood as includingsilicon-on-sapphire (SOS) technology, silicon-on-insulator (SOI)technology, thin film transistor (TFT) technology, doped and undopedsemiconductors, epitaxial layers of a silicon supported by a basesemiconductor structure, as well as other semiconductor structures wellknown to one skilled in the art. Furthermore, when reference is made toa wafer or substrate in the following description, previous processsteps may have been utilized to form regions/junctions in the basesemiconductor structure, and terms wafer or substrate include theunderlying layers containing such regions/junctions. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present invention is defined only by the appendedclaims and equivalents thereof.

FIG. 1 is a block diagram illustration of an integrated circuit device,such as a processor, a memory device 102, etc., according to anembodiment of the invention. The memory device 102 may be fabricated assemiconductor device on a semiconductor substrate. Examples of memorydevices include NAND, NOR, or NROM flash memory devices, dynamic randomaccess memory devices (DRAMs), static random access memory devices(SRAMs), or the like.

For one embodiment, memory device 102 includes an array of flash memorycells 104 and a region 105 peripheral to memory array 104 that includesan address decoder 106, row access circuitry 108, column accesscircuitry 110, control circuitry 112, Input/Output (I/O) circuitry 114,and an address buffer 116. The row access circuitry 108 and columnaccess circuitry 110 may include high-voltage circuitry, such ashigh-voltage pumps. The device of FIG. 1 includes isolation regionsformed in accordance with an embodiment of the invention, e.g., betweenregion 105 and memory 104 as well as within memory array 104.

Memory device 100 may be coupled an external microprocessor 120, ormemory controller, for memory accessing as part of an electronic system.The memory device 102 receives control signals from the processor 120over a control link 122. The memory cells are used to store data thatare accessed via a data (DQ) link 124. Address signals are received viaan address link 126 that are decoded at address decoder 106 to accessthe memory array 104. Address buffer circuit 116 latches the addresssignals. The memory cells are accessed in response to the controlsignals and the address signals. It will be appreciated by those skilledin the art that additional circuitry and control signals can beprovided, and that the memory device of FIG. 1 has been simplified tohelp focus on the invention.

The memory array 104 includes memory cells arranged in row and columnfashion. For one embodiment, each of the memory cells includes afloating-gate field-effect transistor capable of holding a charge. Thecells may be grouped into blocks. Each of the cells within a block canbe electrically programmed on an individual basis by charging thefloating gate. The charge can be removed from the floating gate by ablock erase operation.

FIG. 2 is a schematic of a NAND memory array 200 as a portion of memoryarray 104 of FIG. 1 in accordance with another embodiment of theinvention. As shown in FIG. 2, the memory array 200 includes word lines202 ₁ to 202 _(N) and intersecting local bit lines 204 ₁ to 204 _(M).For ease of addressing in the digital environment, the number of wordlines 202 and the number of bit lines 204 are each some power of two,e.g., 256 word lines 202 by 4,096 bit lines 204. The local bit lines 204are coupled to global bit lines (not shown) in a many-to-onerelationship.

Memory array 200 includes NAND strings 206 ₁ to 206 _(M). Each NANDstring includes floating-gate transistors 208 ₁ to 208 _(N), eachlocated at an intersection of a word line 202 and a local bit line 204.The floating-gate transistors 208 represent non-volatile memory cellsfor storage of data. The floating-gate transistors 208 of each NANDstring 206 are connected in series, source to drain, between a sourceselect gate 210, e.g., a field-effect transistor (FET), and a drainselect gate 212, e.g., an FET. Each source select gate 210 is located atan intersection of a local bit line 204 and a source select line 214,while each drain select gate 212 is located at an intersection of alocal bit line 204 and a drain select line 215.

A source of each source select gate 210 is connected to a common sourceline 216. The drain of each source select gate 210 is connected to thesource of the first floating-gate transistor 208 of the correspondingNAND string 206. For example, the drain of source select gate 210 ₁ isconnected to the source of floating-gate transistor 208 ₁ of thecorresponding NAND string 206 ₁. A control gate 220 of each sourceselect gate 210 is connected to source select line 214.

The drain of each drain select gate 212 is connected to a local bit line204 for the corresponding NAND string at a drain contact 228. Forexample, the drain of drain select gate 212 ₁ is connected to the localbit line 204 ₁ for the corresponding NAND string 206 ₁ at drain contact228 ₁. The source of each drain select gate 212 is connected to thedrain of the last floating-gate transistor 208 of the corresponding NANDstring 206. For example, the source of drain select gate 212 ₁ isconnected to the drain of floating-gate transistor 208 _(N) of thecorresponding NAND string 206 ₁.

Typical construction of floating-gate transistors 208 includes a source230 and a drain 232, a floating gate 234, and a control gate 236, asshown in FIG. 2. Floating-gate transistors 208 have their control gates236 coupled to a word line 202. A column of the floating-gatetransistors 208 are those NAND strings 206 coupled to a given local bitline 204. A row of the floating-gate transistors 208 are thosetransistors commonly coupled to a given word line 202. Memory array 200includes isolation regions formed in accordance with embodiments of theinvention, e.g., between columns of memory array 200.

FIG. 3 is a schematic of a NOR memory array 300 as a portion of memoryarray 104 of FIG. 1 in accordance with another embodiment of theinvention. Memory array 300 includes word lines 302 ₁ to 302 _(P) andintersecting local bit lines 304 ₁ to 304 _(Q). For ease of addressingin the digital environment, the number of word lines 302 and the numberof bit lines 304 are each some power of two, e.g., 256 word lines 302 by4,096 bit lines 304. The local bit lines 304 are coupled to global bitlines (not shown) in a many-to-one relationship.

Floating-gate transistors 308 are located at each intersection of a wordline 302 and a local bit line 304. The floating-gate transistors 308represent non-volatile memory cells for storage of data. Typicalconstruction of such floating-gate transistors 308 includes a source 310and a drain 312, a floating gate 314, and a control gate 316.

Floating-gate transistors 308 having their control gates 316 coupled toa word line 302 typically share a common source depicted as array source318. As shown in FIG. 3, floating-gate transistors 308 coupled to twoadjacent word lines 302 may share the same array source 318.Floating-gate transistors 308 have their drains 312 coupled to a localbit line 304. A column of the floating-gate transistors 308 includesthose transistors commonly coupled to a given local bit line 304. A rowof the floating-gate transistors 308 includes those transistors commonlycoupled to a given word line 302. Memory array 300 includes isolationregions formed in accordance with embodiments of the invention, e.g.,between columns of memory array 300.

To reduce problems associated with high resistance levels in the arraysource 318, the array source 318 is regularly coupled to a metal orother highly conductive line to provide a low-resistance path to ground.The array ground 320 serves as this low-resistance path.

FIG. 4 is an illustration of an exemplary memory module 400. Memorymodule 400 is illustrated as a memory card, although the conceptsdiscussed with reference to memory module 400 are applicable to othertypes of removable or portable memory, e.g., USB flash drives, and areintended to be within the scope of “memory module” as used herein. Inaddition, although one example form factor is depicted in FIG. 4, theseconcepts are applicable to other form factors as well.

In some embodiments, memory module 400 will include a housing 405 (asdepicted) to enclose one or more memory devices 410, though such ahousing is not essential to all devices or device applications. At leastone memory device 410 may be a NAND, NOR, or NROM flash memory device,dynamic random access memory device (DRAMs), static random access memorydevice (SRAMs), or the like having a memory array formed in accordancewith the methods of the invention. Where present, the housing 405includes one or more contacts 415 for communication with a host device.Examples of host devices include digital cameras, digital recording andplayback devices, PDAs, personal computers, memory card readers,interface hubs and the like. For some embodiments, the contacts 415 arein the form of a standardized interface. For example, with a USB flashdrive, the contacts 415 might be in the form of a USB Type-A maleconnector. For some embodiments, the contacts 415 are in the form of asemi-proprietary interface, such as might be found on CompactFlash™memory cards licensed by SanDisk Corporation, Memory Stick™ memory cardslicensed by Sony Corporation, SD Secure Digital™ memory cards licensedby Toshiba Corporation and the like. In general, however, contacts 415provide an interface for passing control, address and/or data signalsbetween the memory module 400 and a host having compatible receptors forthe contacts 415.

The memory module 400 may optionally include additional circuitry 420which may be one or more integrated circuits and/or discrete components.For some embodiments, the additional circuitry 420 may include a memorycontroller for controlling access across multiple memory devices 410and/or for providing a translation layer between an external host and amemory device 410. For example, there may not be a one-to-onecorrespondence between the number of contacts 415 and a number of I/Oconnections to the one or more memory devices 410. Thus, a memorycontroller could selectively couple an I/O connection (not shown in FIG.4) of a memory device 410 to receive the appropriate signal at theappropriate I/O connection at the appropriate time or to provide theappropriate signal at the appropriate contact 415 at the appropriatetime. Similarly, the communication protocol between a host and thememory module 400 may be different than what is required for access of amemory device 410. A memory controller could then translate the commandsequences received from a host into the appropriate command sequences toachieve the desired access to the memory device 410. Such translationmay further include changes in signal voltage levels in addition tocommand sequences.

The additional circuitry 420 may further include functionality unrelatedto control of a memory device 410 such as logic functions as might beperformed by an ASIC (application specific integrated circuit). Also,the additional circuitry 420 may include circuitry to restrict read orwrite access to the memory module 400, such as password protection,biometrics or the like. The additional circuitry 420 may includecircuitry to indicate a status of the memory module 400. For example,the additional circuitry 420 may include functionality to determinewhether power is being supplied to the memory module 400 and whether thememory module 400 is currently being accessed, and to display anindication of its status, such as a solid light while powered and aflashing light while being accessed. The additional circuitry 420 mayfurther include passive devices, such as decoupling capacitors to helpregulate power requirements within the memory module 400.

FIGS. 5A-5J are cross-sectional views of a portion of a row of a memoryarray, such as a portion of a row of memory array 104 of FIG. 1, memoryarray 200 of FIG. 2, memory array 300 of FIG. 3, a memory array ofmemory device 410 of FIG. 4, or the like, during various stages offabrication, according to another embodiment of the invention. FIG. 5Adepicts the portion of the memory device after several processing stepshave occurred. Formation of the structure depicted in FIG. 5A is wellknown and will not be detailed herein.

In general, for one embodiment, the structure of FIG. 5A is formed byforming a dielectric layer 502, e.g., an oxide layer, on a semiconductorsubstrate 500, such as a silicon-containing substrate, e.g., amonocrystalline silicon substrate, a P-type monocrystalline siliconsubstrate, etc. Dielectric layer 502 may be blanket deposited orthermally grown on substrate 500 for one embodiment. A dielectric layer506, such as a nitride layer, e.g., a silicon nitride (Si₃N₄) layer, isformed on dielectric layer 502. For one embodiment, dielectric layer 502is a pad oxide layer that acts as a stress buffer between dielectriclayer 506 and substrate 500.

A mask layer (not shown), e.g., an imaging resist layer, such as a layerof photo resist, is formed overlying dielectric layer 506 and ispatterned to define areas of dielectric layers 502 and 506 and ofsubstrate 500 for removal. The areas of dielectric layers 502 and 506and of substrate 500 defined for removal are subsequently removed, e.g.,by etching, to form a trench 510 that exposes a portion of substrate500.

In FIG. 5B a dielectric layer 512 is formed overlying the structure ofFIG. 5A so as to partially fill trench 510. That is, dielectric layer512 is formed adjoining an upper surface of dielectric layer 506 andadjoining the exposed portion of substrate 500 within trench 510 so asto line sidewalls of trench 510 and to fill a lower portion of trench510 above a bottom portion of trench 510. For one embodiment, dielectriclayer 512 is a high-density plasma dielectric, such as a high-densityplasma oxide, e.g., silicon dioxide, deposited using a high-densityplasma (HDP) process. In another embodiment, dielectric layer 512 may beoxide deposited with a TEOS-(tetraethylorthosilicate-) based process.For other embodiments, formation of dielectric layer 512 is stoppedprior to the formation of any voids. For another embodiment, dielectriclayer 512 defines a container-shaped structure within trench 510, asshown in FIG. 5B.

In FIG. 5C, a dielectric layer 514, e.g., a layer of spin-on dielectric(SOD) material, such as a spin-on glass, hydrogen silsesquioxane (HSQ),hexamethyldisiloxane, polysilazane, octamethyltrisiloxane, etc., isformed overlying dielectric layer 512 and overfills trench 510.Dielectric layer 514 is then cured (or annealed), e.g., using asteam-densification process, e.g., steam-oxidation process. A steamdensification/oxidation process typically removes unwanted chemicalgroups and converts materials exposed thereto into silicon dioxide.Reference number 516 is used in subsequent figures to denote thedielectric layer produced by the densification process. For oneembodiment, the steam-densification process is carried out to a levelsuch that dielectric layer 516 can survive a subsequent chemicalmechanical planerization (CMP) process, as shown in FIG. 5D. For anotherembodiment, densification may be carried out at about 600° C. for aboutone hour. However, the steam-densification process may be carried outfor a slightly longer time at a slightly lower temperature or a slightlyshorter time at a slightly higher temperature. The steam-densificationprocess condition should densify the structure sufficiently without overoxidizing exposed silicon. For some embodiments, dielectric layer 512and dielectric layer 516 have substantially similar chemicalcompositions, such as a silicon oxide, e.g., silicon dioxide, butdielectric layer 512 has a lower wet-etch rate than dielectric layer 516and a lower bond-site density.

In FIG. 5D, portions of dielectric layer 516 and dielectric 512 thatoverlie an upper surface of dielectric layer 506 are removed, e.g., bychemical mechanical planerization (CMP). Subsequently, dielectric layer506 is removed, such as by etching, in FIG. 5E. For one embodiment, adry etch etches away dielectric layer 506. In another embodiment, dryetching of dielectric layer 506 includes using sulfur hexafluoride (SF₆)and Hydrogen Bromide (HBr). Using a dry etch instead of a wet etchprevents unwanted excessive or complete removal of the dielectric layer516. Note that dielectric layer 516 forms a plug-like structure that iscontained in the container-shaped structure defined by dielectic layer512, as shown in FIG. 5E.

In FIG. 5F, a portion of dielectric layer 516 (or the plug-likestructure), primarily located above dielectric layer 502, but extendingbelow dielectric layer 502, is subjected to a densification process,e.g., a nitrogen anneal process. For one embodiment, theanneal/densification process is carried out at about 900° C. for aboutone half hour in an inert environment, e.g., in a nitrogen environment.The portion subjected to the anneal/densification process is denoted byreference number 518 to distinguish that although dielectric layers 516and 518 have substantially similar chemical compositions, such as asilicon oxide, e.g., silicon dioxide, dielectric layer 518 has a higherdensity and a lower etch rate than dielectric layer 516 due to moreeffective densification without the constraints of the surroundingmaterials. Note that for one embodiment, dielectric layer 518 anddielectric layer 512 may have substantially similar chemicalcompositions, such as a silicon oxide, e.g., silicon dioxide. Foranother embodiment, dielectric layer 518 and dielectric layer 512 havesubstantially the same etch rates.

As a portion of dielectric layer 516 exceeds the reach of theanneal/densification, a transition region 513, where thebonding-structure density and etch rate transition from those ofdielectric layer 518 to those of dielectric layer 516, may occur.Dielectric layers 512, 518, and 516 form an isolation region 515.

In FIG. 5G, dielectric layer 502 is removed, e.g., by a wet etch,thereby exposing portions of substrate 500 that correspond to activeregions of substrate 500 over which memory cells will be formed. Notethat during the removal of dielectric layer 502 exposed portions ofdielectric layers 512 and 518 may also be removed. Subsequently, adielectric layer 520, e.g., a tunnel dielectric layer of the futurememory cells, such as a tunnel oxide layer, is formed on the exposedportions of substrate 500, in FIG. 5H. For one embodiment, dielectriclayer 520 is thermally grown on substrate 500. A conductive layer 530,e.g., a layer of doped polysilicon, is formed overlying dielectric layer520 and dielectric layers 512 and 518, in FIG. 5H, and, for oneembodiment, forms a portion of a floating gate layer of the futurememory cells. Portions of conductive layer 530 are subsequently removed,e.g., by CMP, in FIG. 5H.

In FIG. 5I, a portion of isolation region 515, e.g., dielectric layer518 is removed, such as by etching in an etch-back process, so that anupper surface of isolation region 515 is recessed below an upper surfaceof conductive layer 530. A dielectric layer 550 is formed on conductivelayer 530 and the exposed upper surface of isolation region 515, asshown in FIG. 5J, and, for one embodiment, forms an interlayerdielectric layer of the future memory cells. For another embodiment,dielectric layer 550 may be one or more layers of dielectric material.For example, dielectric layer 550 could be of a multi-layer dielectricmaterial commonly referred to as ONO (oxide-nitride-oxide). Otherdielectric materials may be substituted for the ONO, such as tantalumoxide, barium strontium titanate, silicon nitride, and other materialsproviding dielectric properties.

A conductive layer 560 is formed overlying dielectric layer 550, asshown in FIG. 5J, and forms, for one embodiment, a control gate layer(or word line) of memory cells 570, e.g., floating-gate memory cells (orfloating-gate transistors). Conductive layer 560 is generally one ormore layers of conductive material. For one embodiment, conductive layer560 contains a conductively-doped polysilicon. For a further embodiment,conductive layer 560 includes a metal-containing layer overlying apolysilicon layer, e.g., a refractory metal silicide layer formed on aconductively-doped polysilicon layer. The metals of chromium (Cr),cobalt (Co), hafnium (Hf), molybdenum (Mo), niobium (Nb), tantalum (Ta),titanium (Ti), tungsten (W), vanadium (V) and zirconium (Zr) aregenerally recognized as refractory metals. For another embodiment,conductive layer 560 contains multiple metal-containing layers, e.g., atitanium nitride (TiN) barrier layer overlying dielectric layer 550, atitanium (Ti) adhesion layer overlying the barrier layer, and a tungsten(W) layer overlying the adhesion layer. An insulative cap layer (notshown) is often formed overlying conductive layer 560 to protect andisolate conductive layer 560 from further processing.

Note that dielectric layer 512 (FIG. 5J) defines a container-likestructure that contains a portion of a dielectric-plug structure formedfrom dielectric layers 516 and 518 and transition region 513. Notefurther that in one embodiment, another portion of the dielectric-plugstructure, e.g., a portion of dielectric layer 518, extends above anupper surface of substrate 500 between dielectric layer 520 and at leasta portion of conductive layer 530.

It is noted that FIGS. 5A-5J depict a portion of a row of memory cells,such as a row 202 of FIG. 2 or a row 302 of FIG. 3, running parallel toa face plane of the drawings. Columns of memory cells, separated by theisolation regions 515, run perpendicular to the drawings, with sourceand drain regions formed at opposing ends of dielectric layer 520, oneabove the face plane of the figures and one below the face plane of thefigures. Isolation regions 515 act to electrically isolate memory cellsof adjacent columns from each other. It is noted that FIGS. 5A-5J candepict either a NOR-type memory device or a NAND-type memory device,with the differences occurring in the column direction in manners thatare well understood in the art of memory fabrication.

CONCLUSION

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe invention will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the invention. It is manifestly intended that thisinvention be limited only by the following claims and equivalentsthereof.

1. A memory array, comprising: a substrate; a plurality of intersectingrows and columns formed on the substrate, each intersection of a row andcolumn defining a memory cell; and an isolation region disposed betweenadjacent columns of memory cells, wherein the isolation regioncomprises: a layer of high-density plasma dielectric material formedwithin the substrate and adjoining the substrate; and a second layer ofdielectric material having a first portion within the substrate andadjoining the layer of high-density plasma dielectric material and asecond portion extending above an upper surface of the substrate betweenthe memory cells of adjacent columns, wherein at least a portion of thefirst portion of the second layer of dielectric material has a lowerdensification level than the second portion of the second layer ofdielectric material.
 2. The memory array of claim 1, wherein thehigh-density plasma dielectric material is a high-density plasma oxide.3. The memory array of claim 1, wherein the second portion of the secondlayer of dielectric material extends between floating gates of thememory cells of the adjacent columns.
 4. The memory array of claim 3,wherein an upper surface of the second portion of the second layer ofdielectric material extending between floating gates of the memory cellsof the adjacent columns is at a depth lower than upper surfaces of thefloating gates of the memory cells of the adjacent columns.
 5. Thememory array of claim 4, further comprising a dielectric over andadjoining the upper surface of the second portion of the second layer ofdielectric material and the upper surfaces of the floating gates of thememory cells of the adjacent columns.
 6. The memory array of claim 5,further comprising a conductor over the dielectric.
 7. The memory arrayof claim 6, wherein a portion of the conductor is located between thefloating gates of the memory cells of the adjacent columns.
 8. Thememory array of claim 7, wherein the conductor forms a control gate ofthe memory cells of the adjacent columns.
 9. The memory array of claim1, wherein ends of layer of high-density plasma dielectric materialextend to a level of the upper surface of the substrate.
 10. The memoryarray of claim 9, wherein ends of layer of high-density plasmadielectric material extend to a level above an upper surface of thefirst portion of the second layer of dielectric material.
 11. The memoryarray of claim 1, wherein each memory cell is a floating-gate memorycell.
 12. The memory array of claim 1, wherein each memory cell is aflash memory cell.
 13. A memory array, comprising: a substrate; aplurality of intersecting rows and columns formed on the substrate, eachintersection of a row and column defining a non-volatile memory cell;and an isolation region disposed between adjacent columns ofnon-volatile memory cells, wherein the isolation region comprises: alayer of high-density plasma oxide formed within the substrate andadjoining the substrate; and a layer of densified spin-on dielectricmaterial having a first portion within the substrate and adjoining thelayer of high-density plasma oxide and a second portion extending abovean upper surface of the substrate between the memory cells of adjacentcolumns, wherein at least a portion of the first portion of thedensified spin-on dielectric material has a lower densification levelthan the second portion of the densified spin-on dielectric material.14. A memory module, comprising: a plurality of contacts; and two ormore memory devices, each having access lines selectively coupled to theplurality of contacts; wherein at least one of the memory devicescomprises a memory array, comprising: a plurality of intersecting rowsand columns formed on a substrate, each intersection of a row and columndefining a memory cell; and an isolation region disposed betweenadjacent columns of memory cells, wherein the isolation regioncomprises: a layer of high-density plasma dielectric material formedwithin the substrate and adjoining the substrate; and a second layer ofdielectric material having a first portion within the substrate andadjoining the layer of high-density plasma dielectric material and asecond portion extending above an upper surface of the substrate betweenthe memory cells of adjacent columns, wherein at least a portion of thefirst portion of the second layer of dielectric material has a lowerdensification level than the second portion of the second layer ofdielectric material.
 15. The memory module of claim 14, wherein thememory cells are non-volatile memory cells.
 16. The memory module ofclaim 14, wherein the high-density plasma dielectric material is ahigh-density plasma oxide.
 17. A memory module, comprising: a pluralityof contacts; and two or more memory devices, each having access linesselectively coupled to the plurality of contacts; wherein at least oneof the memory devices comprises a memory array, comprising: a pluralityof intersecting rows and columns formed on a substrate, eachintersection of a row and column defining a non-volatile memory cell;and an isolation region disposed between adjacent columns of memorycells, wherein the isolation region comprises: a layer of high-densityplasma oxide formed within the substrate and adjoining the substrate;and a layer of densified spin-on dielectric material having a firstportion within the substrate and adjoining the layer of high-densityplasma dielectric material and a second portion extending above an uppersurface of the substrate between the memory cells of adjacent columns,wherein at least a portion of the first portion of the densified spin-ondielectric material has a lower densification level than the secondportion of the densified spin-on dielectric material.
 18. A memorymodule, comprising: a housing having a plurality of contacts; and one ormore memory devices enclosed in the housing and selectively coupled tothe plurality of contacts; wherein at least one of the memory devicescomprises a memory array, comprising: a plurality of intersecting rowsand columns formed on a substrate, each intersection of a row and columndefining a memory cell; and an isolation region disposed betweenadjacent columns of memory cells, wherein the isolation regioncomprises: a layer of high-density plasma dielectric material formedwithin the substrate and adjoining the substrate; and a second layer ofdielectric material having a first portion within the substrate andadjoining the layer of high-density plasma dielectric material and asecond portion extending above an upper surface of the substrate betweenthe memory cells of adjacent columns, wherein at least a portion of thefirst portion of the second layer of dielectric material has a lowerdensification level than the second portion of the second layer ofdielectric material.
 19. A memory module, comprising: a housing having aplurality of contacts; and one or more memory devices enclosed in thehousing and selectively coupled to the plurality of contacts; wherein atleast one of the memory devices comprises a memory array, comprising: aplurality of intersecting rows and columns formed on a substrate, eachintersection of a row and column defining a non-volatile memory cell;and an isolation region disposed between adjacent columns of memorycells, wherein the isolation region comprises: a layer of high-densityplasma oxide formed within the substrate and adjoining the substrate;and a layer of densified spin-on dielectric material having a firstportion within the substrate and adjoining the layer of high-densityplasma dielectric material and a second portion extending above an uppersurface of the substrate between the memory cells of adjacent columns,wherein at least a portion of the first portion of the oxidized spin-ondielectric material has a lower densification level than the secondportion of the densified spin-on dielectric material.
 20. An electronicsystem, comprising: a processor; and one or more memory devices coupledto the processor, wherein at least one of the memory devices comprises amemory array, comprising: a plurality of intersecting rows and columnsformed on a substrate, each intersection of a row and column defining amemory cell; and an isolation region disposed between adjacent columnsof memory cells, wherein the isolation region comprises: a layer ofhigh-density plasma dielectric material formed within the substrate andadjoining the substrate; and a second layer of dielectric materialhaving a first portion within the substrate and adjoining the layer ofhigh-density plasma dielectric material and a second portion extendingabove an upper surface of the substrate between the memory cells ofadjacent columns, wherein at least a portion of the first portion of thesecond layer of dielectric material has a lower densification level thanthe second portion of the second layer of dielectric material.
 21. Theelectronic system of claim 20, wherein the memory cells are non-volatilememory cells.
 22. The electronic system of claim 20, wherein thehigh-density plasma dielectric material is a high-density plasma oxide.23. An electronic system, comprising: a processor; and one or morememory devices coupled to the processor, wherein at least one of thememory devices comprises a memory array, comprising: a plurality ofintersecting rows and columns formed on a substrate, each intersectionof a row and column defining a non-volatile memory cell; and anisolation region disposed between adjacent columns of memory cells,wherein the isolation region comprises: a layer of high-density plasmaoxide formed within the substrate and adjoining the substrate; and alayer of densified spin-on dielectric material having a first portionwithin the substrate and adjoining the layer of high-density plasmadielectric material and a second portion extending above an uppersurface of the substrate between the memory cells of adjacent columns,wherein at least a portion of the first portion of the densified spin-ondielectric material has a lower densification level than the secondportion of the densified spin-on dielectric material.